Thermalright LGA1700 12th Gen Bending correction Frame
Sol3Trek
Intel desktop Alder Lake processors are prone to bending or warping, an issue caused by a pressure applied by the latching system for LGA1700 socket. The bending problem causes the integrated heat spreader (IHS) to bend and lose the uniformity, which may lead to lower cooling efficiency by creating a gap between the cooler and the processor.
It’s compatibility with specific motherboards and other cooling solutions has not been confirmed, but the seller claims it supports H610, B660 and Z690 motherboards. It is not yet available for sale in other regions.
Please let me know which colour you would like.
$25.00
Intel desktop Alder Lake processors are prone to bending or warping, an issue caused by a pressure applied by the latching system for LGA1700 socket. The bending problem causes the integrated heat spreader (IHS) to bend and lose the uniformity, which may lead to lower cooling efficiency by creating a gap between the cooler and the processor.
It’s compatibility with specific motherboards and other cooling solutions has not been confirmed, but the seller claims it supports H610, B660 and Z690 motherboards. It is not yet available for sale in other regions.
Please let me know which color you would like.
Specification: Thermalright LGA1700 12th Gen Bending correction Frame
| Weight | .5 lbs |
|---|---|
| Dimensions | 4 × 4 × 1 in |
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- Store Name: Sol3Trek
- Vendor: Sol3Trek
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